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Prepare for the Economic Recovery
With the Proven Lead-Free (Pb free) Assembly Programme.
Providing a complete and technologically proven Pb-Free solution tailored for each assembly process.
BENEFITS
- Bring your Pb-Free Product to market quickly
- Eliminates cost of product and process development
- Provides identification of critical process variables for Pb-Free implementation
- Access to more than 2 years of Research & Development data
- Identifies the pitfalls in a Pb-Free production environment and how to avoid them before they cost you money
- Fully supported implementation
- Optimized Reflow Profile
- Real World production history
FEATURES
- Documented Pb-Free Operating characteristics
- Design of Experiments for Pb-Free interconnect assemblies
- Solder Paste print performance parameters
- Visual expectations for post reflow boards
- Wetting expectations for various materials
- Pad and stencil design recommendations and guidelines
- Optimized profile development
- Addresses electrical and mechanical performance of Pb-Free interconnections
- On and off site technical support for process issues post implementation
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