Solder paste is a mixture of pre-alloyed solder powder and flux/vehicle.

Formulation of a solder paste, however, is a complex task involving expert knowledge on such factors as powder morphology, solvents, activators, and rheological additives.

Because end applications vary so significantly throughout the industry, Indium Corporation offers a wide selection of solder pastes to choose from, in order to meet each customer's specific needs.

Besides having a selection of over 220 alloys, ICA offers several flux types that encompass a variety of more fine-tuned formulations. Please select from the table below to see detailed information on solder pastes that most interest you.

Pb-free Solder Paste

Indium 3.1
Indium3.1 Pb-Free Water-Soluble Solder Paste. Ideal for applications with Au finger connectors; halide-free with ultra-low flux spattering and solder beading.

Indium5.1
Indium5.1 Pb-Free No-Clean Solder Paste leads the industry in response-to-pause performance with low voiding and a wide reflow process window.

NC-SMQ230
Recommended product for Pb-free alloys. Formulated to accommodate high processing temperatures requires by the Sn/Ag/Cu, Sn/Ag/Bi, and Sn/Ag alloys.