Never before has it been so easy to view the quality of BGA's. Micro-BGA's, solder joints, solder paste print, surface structure placement, alignment and flux process.

The images come alive!

• Optical inspection of solder joints under BGA, uBGA, CSP.
• Thin mirror tip allows access into gaps <2mm.
• Replaceable mirror tip.
• Linear ball bearing arm and large x-y table for large PCB’s.
• Revolutionary Lens With 50x-200x Magnification
• State Of The Art Revolutionary Lens
• Panasonic’s Hi-Resolution 3-Chip CCD Camera
• Unique, Versatile & Flexible Metal Halide Light Source
• Attractive and Sturdy Stage Including X-Y Table
• Sony Hi-Resolution 15" Color Monitor
• Ultimate Video Measurement System (Optional)
• High-Performance Hi-Resolution Frame Grabber (Optional)
• Offers True Ergonomic Benefits To The Work Place