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THE FIRST INDUSTRIAL SOLUTION FOR BGA PACKAGE DEBALLING AND REBALLING.
Fruit of an innovation that allows the process of reballing to be automated, TIN-UP™ responded to the demand of interconnection professionals hoping to recover BGA components or to modify their connection during assembly, test or PCB mounting.
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The automated, BGA De-Balling & Re-Balling Solution:
- Fast & Easy Process.
- Precise & Repeatable.
- Low Temperature Cycling.
Ball Placement Station
Ball sphere recycling system: eliminates waste of costly material. all spheres are gathered in a tank and automatically re-injected by a vortex dispensing shower head. The vibration plate secures the ball placement into the ball placing tool. Ball placement station feature integrates preheating plate and cooling station and secures the reflow process.
Ball Placement Tooling Kit
Specific Aluminum Tooling Kits are compatible with Jedec and EIAJ package dimension specification. Theis tool kit is compatible with Tin-up system. Multi-position imprints allow to increase the throughput.
Universal Ball Placement Tooling Kit
Reduce tooling cost when production is not recurrent and based on a broad range of package configurations. Visual package alignment is performed with an adjustable X, Y mechanism. Tooling kit is assembled according to the specific package configuration.
The Repeatable De-Balling, Re-Balling & Cleaning Process.
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