Thermal Profiling

An incorrect temperature profile in a Reflow oven or Wave soldering process is proven to cause failures in both electronic components and printed circuit board assemblies.

The most effective way to assess the thermal shock to components and the PCB is to measure the actual on-board temperatures as it travels through the soldering process. DTS are pleased to offer the following PROfiler Product Range:

PROfiler, PROwave & Sentry

Profiler (Temperature Profiling system for Reflow & Wave Soldering Processes)

• Real time multi node two way RF telemetry.
• Rapid process set-up and profiling.
• Profile prediction - optimise your process offline, reducing production disruption.
• 6 Type-K thermocouple channels.
• Accurate to +/- 1°C.
• Sample period 0.1 second to 10minutes.
• Robust and simple to use data logger and software.
• Re-chargeable (2hr fast charge).
• Ultra slim system available.

PROsentry (Continuous Reflow Profiling System)

• Accurate temperature measurement at 40points within the oven (+/-1°C).
• SMEMA/Ethernet provide networking and line integration.
• Configurable alarms can activate relay outputs.
• Communication port allows interfacing to PROfiler – temperature Profiling System.
• Large internal memory for buffering of data in the event of network failures.
• Allows lost board detection, oven loading and throughput tracking.
• Provides easy interfacing to third party site management schemes.

Prosentry now ensures EVERY product through the process is monitored and tracked