Lead Free Reflow Oven
HVC HT™ NEW & IMPROVED
HVA/HVN HT™ Series
HVC HT™ More Production. Less downtime
- Models available HVN HT™ 70, HVN HT™102 & HVN HT™155
- 10% More Heated Length for Faster Production
- New Integrated Powered Exhaust & Improved Flux Management
- New Controllable Cooling
- Improved Nitrogen Consumption & Lower Oxygen Levels
- Improved Software
- Improved Safety, Easier Access & Lower Maintenance
 Conceptronic HVC (High Velocity Convection)
HVC Series forced convection ovens are designed for SMT mass reflow soldering, Sn-Pb as well as Pb-Free alloys including epoxy, adhesive, and encapsulant curing.
Tight uniformity and repeatable computerized control, guarantees good solder joints today and many years to come. High convection rates mean minimal changes needed to process a wide range of PCB types.
Higher set points and the longest heated tunnel in its class means lead-free ready without sacrificing throughput.
The Conceptronic HVC HT™ ovens have the same thermal performance that made Conceptronic a preferred oven by engineers for Networking, Automotive, Telecommunications, Medical, Military, and Semiconductor industries.
With controlled convection flow from off-load cooling to on-load exhaust, flux management is simplified by keeping the flux borne atmosphere above the condensation temperature. The low cost of ownership and initial value pricing provide a rapid return on investment. | 
