New Precision BGA Spheres Optimize Sphere Performance.

Indium Corporation’s Solder Spheres for

• PBGA,
• CBGA,
• TBGA,
• µBGA and Flip Chip applications are made by a proprietary manufacturing process that consistently results in high sphericity and accurate diameters.

The solder spheres are available in many alloys including industry standards:

• Sn63Pb37
• Sn62Pb36Ag2
• Pb90Sn10
• Sn95.5Ag3.8Cu0.7
• Sn95.5Ag4.0Cu0.5
• Sn96.5Ag3.0Cu0.5

For more detailed technical information on this product range, please contact DTS Process Technologies Ltd.

Email: enquiries@dtsprocess.com .